JPH0323931U - - Google Patents
Info
- Publication number
- JPH0323931U JPH0323931U JP8408089U JP8408089U JPH0323931U JP H0323931 U JPH0323931 U JP H0323931U JP 8408089 U JP8408089 U JP 8408089U JP 8408089 U JP8408089 U JP 8408089U JP H0323931 U JPH0323931 U JP H0323931U
- Authority
- JP
- Japan
- Prior art keywords
- component
- circuit board
- printed circuit
- hot air
- limits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004888 barrier function Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8408089U JPH075637Y2 (ja) | 1989-07-19 | 1989-07-19 | 加熱式部品取り外し治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8408089U JPH075637Y2 (ja) | 1989-07-19 | 1989-07-19 | 加熱式部品取り外し治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0323931U true JPH0323931U (en]) | 1991-03-12 |
| JPH075637Y2 JPH075637Y2 (ja) | 1995-02-08 |
Family
ID=31632272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8408089U Expired - Lifetime JPH075637Y2 (ja) | 1989-07-19 | 1989-07-19 | 加熱式部品取り外し治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH075637Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006147888A (ja) * | 2004-11-19 | 2006-06-08 | Fujitsu Ltd | 回路チップパッケージの取り外し方法および回路チップパッケージ用取り外し治具 |
-
1989
- 1989-07-19 JP JP8408089U patent/JPH075637Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006147888A (ja) * | 2004-11-19 | 2006-06-08 | Fujitsu Ltd | 回路チップパッケージの取り外し方法および回路チップパッケージ用取り外し治具 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH075637Y2 (ja) | 1995-02-08 |